JPH0438073U - - Google Patents
Info
- Publication number
- JPH0438073U JPH0438073U JP8092890U JP8092890U JPH0438073U JP H0438073 U JPH0438073 U JP H0438073U JP 8092890 U JP8092890 U JP 8092890U JP 8092890 U JP8092890 U JP 8092890U JP H0438073 U JPH0438073 U JP H0438073U
- Authority
- JP
- Japan
- Prior art keywords
- slits
- circuit board
- diamond
- board
- apex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8092890U JPH0438073U (en]) | 1990-07-30 | 1990-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8092890U JPH0438073U (en]) | 1990-07-30 | 1990-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438073U true JPH0438073U (en]) | 1992-03-31 |
Family
ID=31626408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8092890U Pending JPH0438073U (en]) | 1990-07-30 | 1990-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438073U (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123521A (ja) * | 2005-10-27 | 2007-05-17 | Kyocera Corp | 多数個取り配線基板 |
| JP2008109055A (ja) * | 2006-10-27 | 2008-05-08 | Cmk Corp | 集合プリント配線板 |
| WO2025027940A1 (ja) * | 2023-07-28 | 2025-02-06 | 日本発條株式会社 | 集合基板及びその製造方法並びに回路基板の製造方法 |
-
1990
- 1990-07-30 JP JP8092890U patent/JPH0438073U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123521A (ja) * | 2005-10-27 | 2007-05-17 | Kyocera Corp | 多数個取り配線基板 |
| JP2008109055A (ja) * | 2006-10-27 | 2008-05-08 | Cmk Corp | 集合プリント配線板 |
| WO2025027940A1 (ja) * | 2023-07-28 | 2025-02-06 | 日本発條株式会社 | 集合基板及びその製造方法並びに回路基板の製造方法 |